This aluminium material is treated using patented Liquid Metal Alloy Shot Peening (LMASP) technology. The liquid metal alloy shot offers high strength and impact resistance. Compared with conventional abrasive blasting and zirconia bead blasting, LMASP creates a dense pattern of microscopic rounded indentations on the metal surface without damaging the underlying material. This treatment enhances surface hardening, fatigue life, hardness, rigidity and corrosion resistance. It also reduces several pre-coating treatment steps, such as hot degreasing, electrolytic degreasing and acid pickling, while reducing volatile organic compound (VOC) emissions.
The technology can also be used for the rapid thinning and profile cutting of brittle materials, including semiconductor wafers, printed circuit boards (PCBs), ceramics, tiles and glass, providing a new manufacturing solution for the metalworking and semiconductor industries.more
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This aluminium material is treated using patented Liquid Metal Alloy Shot Peening (LMASP) technology. The liquid metal alloy shot offers high strength and impact resistance. Compared with conventional abrasive blasting and zirconia bead blasting, LMASP creates a dense pattern of microscopic rounded indentations on the metal surface without damaging the underlying material. This treatment enhances surface hardening, fatigue life, hardness, rigidity and corrosion resistance. It also reduces several pre-coating treatment steps, such as hot degreasing, electrolytic degreasing and acid pickling, while reducing volatile organic compound (VOC) emissions.
The technology can also be used for the rapid thinning and profile cutting of brittle materials, including semiconductor wafers, printed circuit boards (PCBs), ceramics, tiles and glass, providing a new manufacturing solution for the metalworking and semiconductor industries.